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Series: USN 1206

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Thermal sensitive Fuse, SMD 1206, 32 VDC


Approvals and Compliances

Description USN 1206

Description

  • Temperature sensitive SMD fuse
  • Customer-specific pre-arcing time characteristic as a function of ambient temperature
  • Combination of protection against overcurrent and excessive ambient temperature
  • High melting I²t-values
  • Impermeable to potting compound

Standards

  • Qualification according to AEC-Q200 on request

Applications

  • Secondary Protection DC and AC
  • Automotive electronics
  • Intrinsically safe electronics
  • Battery protection
  • In all electronics with temperature-critical components (eg Mosfet's)
Date Category Subcategory Title Download

Rated Voltage

32 VDC

Rated current

12 A

Breaking Capacity

170 A

Mounting

PCB,SMT

Admissible Ambient Air Temp.

-40 °C to 125 °C

Material: Housing

Epoxyd Glass, UL 94V-0

Material: Terminals

Tin-Plated Copper

Unit Weight

0.01 g

Storage Conditions

0 °C to 40 °C, max. 70% r.h.

Product Marking

Rated current

Soldering Methods

Reflow
Soldering Profile

Solderability

245 °C / 3 sec acc. to IEC 60068-2-58, Test Td

Resistance to Soldering Heat

260 +0/-5 °C / 30 sec acc. to IPC/JEDEC J-STD-020D, Level 1

Moisture Resistance Test

MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)

Terminal Strength

MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)

Case Resistance

acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)

Resistance to Solvents

MIL-STD-202, Method 215A

Flammability

UL 94V-1
(acc. to EIA/IS-722, Test 4.12)


Detailed information on product approvals, code requirements, usage instructions and detailed test conditions can be looked up in  
General Product Information

Preview
 

Picture(s) Selection of product pictures to display a specific variant of the type

Type
 

Type Corresponds to a product series and includes various distinct variants. On the type of descriptive data are summarized, eg in the data sheet

Order Number
 

Order Number Unique part number for placing an order

Configuration key
 

Configuration key The configuration key of a product consists of the composite key values, which describe the different kinds of attribut distinction.

Comment
 
Model Description
 

Model Description Abbreviated description of the CAD model

IGS
 

IGS Also mentioned as IGES ( Initial Graphics Exchange Specification). Common program indipendent interchange format for 3D CAD data.

Step
 

Step Also mentioned as STEP ( Standard for the Exchange of Product Model Data). Common program indipendent interchange format for 3D CAD data standardized according ISO standard.

Parasolid
 

Parasolid Parasolid modeling kernel is a 3D CAD systems. It is developed by a separate business unit within the Unigraphics Solutions (UGS), now Siemens PLM Software.

DXF
 

DXF (Drawing Interchange Format) is a specified by the Autodesk file format for CAD data exchange, and was developed for the 2D-CAD program AutoCAD. A DXF file describes a CAD model as plain text to the ASCII standard.

Dimension [mm]

Reflow soldering pads


Pre-Arcing Time

Rated Current In 18 A @ 240°C ±10°C max. 80 A @ 23°C min.
12 A 170 s 10 ms

Time-Current-Curves

Time in Seconds
Current in Amperes


-A time-current-curve for a stand fuse would be equal even it ambient temperature is high

-The time-current-curve for USN is shifting to the left while ambient temperature increase

Short Table of Variants USN 1206


Rated current Rated Voltage Breaking Capacity Order Number

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A=Most Popular

Most popular products have the following customer benefits:

- previously ordered by multiple customers
- generally in stock for immediate delivery
- early adoption or mature life cycle

Contact us for availability on other product variants, lead-times vary:

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Distributor Stock Check

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...
[A]   [VDC]              
 
12 32 1) 3413.0512.11  A  ...

Most Popular.

1) 170 A @ 16 VDC, 80 A @ 32 VDC


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